Intel Corporation said on Thursday it is developing an integrated module, which would allow quick data transfer while on the move, with plans to launch it next year.
"We are developing an integrated Wi-Fi/Wi-Max module, a single module that has both capabilities, that will be available for laptops and ultra-mobile devices next year," Intel's President and CEO Paul Otellini said at the Intel Developer Forum in San Francisco.
Next year, the company would come out with an optimised Penryn microprocessor which would be fitted with Wi-Fi and Wi-Max.
Otellini said with notebook computers likely to overtake desktops in volume sales in the next couple of years, the new technology would bring in a seamlessly integrated global network.
"We all expect to be connected everywhere. In fact, it is right from many perspectives... Mobility has a lot of room to improve," he said, adding that the world needed new devices, new services and new products.
The contractual commitment today suggest that 150 million people will be covered through Wi-Max in 2008, principally in the North America, 750 million by 2010 and 1.3 billion in 2012.
"Interestingly, though, I think the future of ultra mobility is a lot closer than we think," Otellini said.
Talking about India, Otellini said there was no plan to set up a manufacturing plant in India as of now, despite the booming market and introduction of a new liberalised semiconductor policy.
